LIGO Document T1300040-v1

Clean Soldering Techniques

Document #:
LIGO-T1300040-v1
Document type:
T - Technical notes
Other Versions:
Abstract:
A short note to capture concepts and methods for achieving reliable and relatively clean solder joints for ultra-high vacuum applications. This process is likely to evolve over time, but is initially targeted at soldering items that are not practical to be re-cleaned via the standard LIGO clean and bake process. An example of when this soldering procedure might be used would be a spot repair of a wire or solder joint for an item that is part of a complex system rendering it impractical to disassemble.
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Topics:
Authors:
Keywords:
soldering
Notes and Changes:
Here's a set of data to aid in buying the right solder:
Digi-Key Part Number
KE1110-ND
Manufacturer
Kester Solder
Manufacturer Product Number
24-6337-0007
Description
SOLDER RA FLUX 27AWG 63/37 1LB
Detailed Description
Leaded Rosin Activated (RA) Wire Solder Sn63Pb37 (63/37) 27 AWG, 28 SWG Spool, 1 lb (454 g)

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