Altium

Design Rule Verification Report

Date	:	1/7/2016
Time	:	4:42:45 PM
Elapsed Time	:	00:00:01
Filename	:	C:\Rich's Files\Mycadfiles\ISC\WFS_Triplexer\WFS_Triplexer.PcbDoc

Warnings	:	0
Rule Violations	:	17

Summary

Warnings	Count
Total	0

Rule Violations	Count
Short-Circuit Constraint (Allowed=No) (All),(All)	0
Un-Routed Net Constraint ( (All) )	0
Clearance Constraint (Gap=10mil) (All),(All)	0
Power Plane Connect Rule(Relief Connect )(Expansion=20mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All)	0
Width Constraint (Min=10mil) (Max=100mil) (Preferred=20mil) (All)	0
Height Constraint (Min=0mil) (Max=1000mil) (Prefered=500mil) (All)	0
Hole Size Constraint (Min=1mil) (Max=200mil) (All)	0
Hole To Hole Clearance (Gap=10mil) (All),(All)	0
Minimum Solder Mask Sliver (Gap=5mil) (All),(All)	17
Silkscreen Over Component Pads (Clearance=5mil) (All),(All)	0
Silk to Silk (Clearance=5mil) (All),(All)	0
Net Antennae (Tolerance=0mil) (All)	0
Room CH1 (Bounding Region = (7520mil, 3230mil, 7775mil, 3300mil) (Disabled)(InComponentClass('CH1'))	0
Room WFS_TriplexerTop (Bounding Region = (7550mil, 3100mil, 7735mil, 3185mil) (Disabled)(InComponentClass('WFS_TriplexerTop'))	0
Total	17

Minimum Solder Mask Sliver (Gap=5mil) (All),(All)
Via (1015mil,605mil) Top Layer to Bottom Layer	Pad L8-1(1000mil,535mil) Top Layer
Via (350mil,735mil) Top Layer to Bottom Layer	Pad L7-1(350mil,670mil) Top Layer
Via (1295mil,905mil) Top Layer to Bottom Layer	Pad C7-1(1295mil,955mil) Top Layer
Via (780mil,1965mil) Top Layer to Bottom Layer	Pad L2-1(835mil,1965mil) Top Layer
Via (570mil,1640mil) Top Layer to Bottom Layer	Pad C4-1(570mil,1689mil) Top Layer
Via (425mil,1725mil) Top Layer to Bottom Layer	Pad C2-1(425mil,1776.599mil) Top Layer
Via (325mil,1725mil) Top Layer to Bottom Layer	Pad C3-1(325mil,1776.599mil) Top Layer
Via (1580mil,1955mil) Top Layer to Bottom Layer	Pad J3-3(1522mil,1956mil) Top Layer
Via (1130mil,1970mil) Top Layer to Bottom Layer	Pad J3-2(1188mil,1956mil) Top Layer
Via (150mil,875mil) Top Layer to Bottom Layer	Pad J2-2(139mil,933mil) Top Layer
Via (155mil,2075mil) Top Layer to Bottom Layer	Pad J1-3(139mil,2017mil) Top Layer
Via (160mil,1625mil) Top Layer to Bottom Layer	Pad J1-2(139mil,1683mil) Top Layer
Via (1580mil,1955mil) Top Layer to Bottom Layer	Pad J3-5(1522mil,1956mil) Bottom Layer
Via (1130mil,1970mil) Top Layer to Bottom Layer	Pad J3-4(1188mil,1956mil) Bottom Layer
Via (150mil,875mil) Top Layer to Bottom Layer	Pad J2-4(139mil,933mil) Bottom Layer
Via (155mil,2075mil) Top Layer to Bottom Layer	Pad J1-5(139mil,2017mil) Bottom Layer
Via (160mil,1625mil) Top Layer to Bottom Layer	Pad J1-4(139mil,1683mil) Bottom Layer